Part Number Hot Search : 
P16NF06F C1641 MPC755CD MMSZ4V3 24300 AS105 4040E 4040E
Product Description
Full Text Search
 

To Download HD74ALVC2G32 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 HD74ALVC2G32
Dual 2-input OR Gates
REJ03D0166-0400Z (Previous ADE-205-613C (Z)) Rev.4.00 Dec.18.2003
Description
The HD74ALVC2G32 has two-input OR gate in an 8 pin package. Low voltage and high-speed operation is suitable for the battery powered products (e.g., notebook computers), and the low power consumption extends the battery life.
Features
* The basic gate function is lined up as Renesas uni logic series. * Supplied on emboss taping for high-speed automatic mounting. * Supply voltage range : 1.2 to 3.6 V Operating temperature range: -40 to +85C * All inputs VIH (Max.) = 3.6 V (@VCC = 0 V to 3.6 V) All outputs VO (Max.) = 3.6 V (@VCC = 0 V) * Output current 2 mA (@VCC = 1.2 V) 4 mA (@VCC = 1.4 V to 1.6 V) 6 mA (@VCC = 1.65 V to 1.95 V) 18 mA (@VCC = 2.3 V to 2.7 V) 24 mA (@VCC = 3.0 V to 3.6 V) * Ordering Information
Part Name HD74ALVC2G32USE Package Type SSOP-8 pin Package Code TTP-8DBV Package Abbreviation US Taping Abbreviation (Quantity) E (3,000 pcs/reel)
Rev.4.00, Dec.18.2003, page 1 of 9
HD74ALVC2G32
Outline and Article Indication
* HD74ALVC2G32
Index band Lot No.
YMW A32
SSOP-8 Marking
Y : Year code (the last digit of year) M : Month code W : Week code
Function Table
Inputs A L H L H H: L: High level Low level B L L H H Output Y L H H H
Rev.4.00, Dec.18.2003, page 2 of 9
HD74ALVC2G32
Pin Arrangement
1A
1
8
VCC
1B
2
7
1Y
2Y
3
6
2B
GND
4
5
2A
(Top view)
Absolute Maximum Ratings
Item Supply voltage range Input voltage range *1 Output voltage range
*1, 2
Symbol VCC VI VO IIK IOK IO ICC or IGND PT Tstg
Ratings -0.5 to 4.6 -0.5 to 4.6 -0.5 to VCC+0.5 -0.5 to 4.6 -50 50 50 100 200 -65 to 150
Unit V V V
Conditions
Output : H or L VCC : OFF
Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND Maximum power dissipation *3 at Ta = 25C (in still air) Storage temperature Notes:
mA mA mA mA mW C
VI < 0 VO < 0 or VO > VCC VO = 0 to VCC
The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150C.
Rev.4.00, Dec.18.2003, page 3 of 9
HD74ALVC2G32
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Output current Symbol VCC VI VO IOH Min 1.2 0 0 IOL Input transition rise or fall rate t / v Ta 0 0 Operating free-air temperature -40 Note: Unused or floating inputs must be held high or low. Max 3.6 3.6 VCC -2 -4 -6 -18 -24 2 4 6 18 24 20 10 85 C ns / V Unit V V V mA VCC = 1.2 V VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 3.0 V VCC = 1.2 V VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 3.0 V VCC = 1.2 to 2.7 V VCC = 3.30.3 V Conditions
Rev.4.00, Dec.18.2003, page 4 of 9
HD74ALVC2G32
Electrical Characteristics
(Ta = -40 to 85C)
Item Input voltage Symbol VIH VCC (V) * 1.2 1.4 to 1.6 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 VIL 1.2 1.4 to 1.6 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 Output voltage VOH Min to Max 1.2 1.4 1.65 2.3 3.0 VOL Min to Max 1.2 1.4 1.65 2.3 3.0 Input current Quiescent supply current Output leakage current Input capacitance IIN ICC IOFF CIN 3.6 3.6 0 3.3 Min VCCx0.7 VCCx0.7 1.7 2.0 VCC-0.2 0.9 1.1 1.2 1.7 2.2 Typ 4.5 Max VCCx0.25 VCCx0.3 VCCx0.3 0.7 0.8 0.2 0.3 0.3 0.3 0.55 0.55 5 10 5 A A A pF V IOH = -100 A IOH = -2 mA IOH = -4 mA IOH = -6 mA IOH = -18 mA IOH = -24 mA IOL = 100 A IOL = 2 mA IOL = 4 mA IOL = 6 mA IOL = 18 mA IOL = 24 mA VIN = 3.6 V or GND VIN = VCC or GND, IO = 0 VIN or VO = 0 to 3.6 V VIN = VCC or GND Unit V Test conditions
VCCx0.75
Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions.
Rev.4.00, Dec.18.2003, page 5 of 9
HD74ALVC2G32
Switching Characteristics
(Ta = -40 to 85C) VCC = 1.2 V
Item Propagation delay time Symbol tPLH tPHL Min Typ 7.5 Max Unit ns Test conditions CL = 15 pF FROM (Input) A or B TO (Output) Y
VCC = 1.50.1 V
Item Propagation delay time Symbol tPLH tPHL Min 2.0 Typ Max 7.0 Unit ns Test conditions CL = 15 pF FROM (Input) A or B TO (Output) Y
VCC = 1.80.15 V
Item Propagation delay time Symbol tPLH tPHL Min 1.5 Typ Max 5.0 Unit ns Test conditions CL = 30 pF FROM (Input) A or B TO (Output) Y
VCC = 2.50.2 V
Item Propagation delay time Symbol tPLH tPHL Min 1.0 Typ Max 3.7 Unit ns Test conditions CL = 30 pF FROM (Input) A or B TO (Output) Y
VCC = 3.30.3 V
Item Propagation delay time Symbol tPLH tPHL Min 1.0 Typ Max 2.8 Unit ns Test conditions CL = 30 pF FROM (Input) A or B TO (Output) Y
Rev.4.00, Dec.18.2003, page 6 of 9
HD74ALVC2G32
Operating Characteristics
(Ta = 25C)
Item Power dissipation capacitance Symbol CPD VCC (V) 1.5 1.8 2.5 3.3 Min Typ 10.5 10.5 10.5 11.5 Max Unit pF Test conditions f = 10 MHz
Test Circuit
VCC
Pulse Generator Z out = 50
Input Output
CL
RL
Symbol RL CL
V CC = 1.2 V, V = 2.50.2 V, V = 1.80.15 V CC 1.50.1 V CC 3.30.3 V 2.0 k 15 pF 1.0 k 30 pF 500 30 pF
Note: CL includes probe and jig capacitance.
Rev.4.00, Dec.18.2003, page 7 of 9
HD74ALVC2G32 Waveforms
tr tf
90% Input V ref 10%
90% V ref 10%
VIH
GND t PHL VOH
t PLH
Output
V ref
V ref VOL
Symbol tr / t f V IH V ref
V CC = 1.2 V, 1.50.1 V, V CC = 2.50.2 V 1.80.15 V 2.0 ns VCC 50% 2.5 ns VCC 50%
V CC = 3.30.3 V 2.5 ns 2.7 V 1.5 V
Note: Input waveform : PRR = 10 MHz, duty cycle 50%
Rev.4.00, Dec.18.2003, page 8 of 9
HD74ALVC2G32
Package Dimensions
2.0 0.2 1.5 0.2 (0.5) (0.5) (0.5)
Unit: mm
(0.4) 2.3 0.1 3.1 0.3
0 - 0.1
8 - 0.2 - 0.05
+ 0.1
(0.17)
0.7 0.1 (0.4)
Package Code JEDEC JEITA Mass (reference value)
TTP-8DBV 0.010 g
Rev.4.00, Dec.18.2003, page 9 of 9
0.13 - 0.05
+ 0.1
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2003. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon 1.0


▲Up To Search▲   

 
Price & Availability of HD74ALVC2G32

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X